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1 fn6307.5 isl3170e, isl3171e, isl3172e, isl3173e, isl3174e, isl3175e, isl3176e, isl3177e , isl3178e 15kv esd protected, 3. 3v, full fail-safe, low power, high speed or slew rate limited, rs-485/rs-422 transceivers the intersil isl317xe are 15kv iec61000 esd protected, 3.3v-powered, single transceivers that meet both the rs-485 and rs-422 standards for balanced communication. these devices have very low bus currents (+125ma/-100ma), so they present a true ?1/8 uni t load? to the rs-485 bus. this allows up to 256 transceivers on the network without violating the rs-485 specification?s 32 uni t load maximum, and without using repeaters. for example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an rs-485 network, so the high allowed node count minimizes the number of repeaters required. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or terminated but undriven. hot plug circuitry ensures that the tx and rx outputs remain in a high impedance state while the power supply stabilizes. the isl3170e through isl3175e utilize slew rate limited drivers which reduce emi, and minimize reflections from improperly terminated transmi ssion lines, or unterminated stubs in multidrop and multipoint applications. slew rate limited versions also include receiver input filtering to enhance noise immunity in the presence of slow input signals. the isl3170e, isl3171e, isl3173e, isl3174e, isl3176e, isl3177e are configured for full duplex (separate rx input and tx output pins) applications. the half duplex versions multiplex the rx inputs and tx outputs to allow transceivers with output disable functions in 8 ld packages. features ? iec61000 esd protection on rs-485 i/o pins . . . . . 15kv - class 3 esd level on all other pins . . . . . . >7kv hbm ? full fail-safe (open, short, terminated/floating) receivers ? hot plug - tx and rx outputs remain three-state during power-up (only versions with output enable pins) ? true 1/8 unit load allows up to 256 devices on the bus ? single 3.3v supply ? high data rates . . . . . . . . . . . . . . . . . . . . . . up to 20mbps ? low quiescent supply current . . . . . . . . . . .800 a (max) - ultra low shutdown supply current . . . . . . . . . . .10na ? -7v to +12v common mode input/output voltage range ? half and full duplex pinouts ? three state rx and tx outputs available ? current limiting and thermal shutdown for driver overload protection ? tiny msop packages consume 50% less board space ? pb-free (rohs compliant) applications ? automated utility meter reading systems ? high node count systems ? field bus networks ? security camera networks ? building environmental control/ lighting systems ? industrial/process control networks table 1. summary of features part number half/full duplex data rate (mbps) slew-rate limited? hot plug? # devices on bus rx/tx enable? quiescent i cc (a) low power shutdown? pin count isl3170e full 0.25 yes yes 256 yes 510 yes 10, 14 isl3171e full 0.25 yes no 256 no 510 no 8 isl3172e half 0.25 yes yes 256 yes 510 yes 8 isl3173e full 0.5 yes yes 256 yes 510 yes 10, 14 isl3174e full 0.5 yes no 256 no 510 no 8 isl3175e half 0.5 yes yes 256 yes 510 yes 8 isl3176e full 20 no yes 256 yes 510 yes 10, 14 isl3177e full 20 no no 256 no 510 no 8 isl3178e half 20 no yes 256 yes 510 yes 8 data sheet june 8, 2012 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2006-2008, 2012. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners.
2 fn6307.5 june 8, 2012 pinouts isl3172e, isl3175e, isl3178e (8 ld msop, soic) top view isl3171e, isl3174e, isl3177e (8 ld msop, soic) top view isl3170e, isl3173e, isl3176e (10 ld msop) top view isl3170e, isl3173e, isl3176e (14 ld soic) top view ro re de di 1 2 3 4 8 7 6 5 vcc b/z a/y gnd d r vcc ro di gnd 1 2 3 4 8 7 6 5 a b z y d r ro re de di gnd vcc a b z y 1 2 3 4 5 10 9 8 7 6 d r nc ro re de di gnd gnd vcc nc a b z y nc 1 2 3 4 5 6 7 14 13 12 11 10 9 8 d r ordering information part number (notes 1, 2, 3) part marking temp. range (c) package (pb-free) pkg. dwg. # isl3170eibz 3170eibz -40 to +85 14 ld soic m14.15 isl3170eiuz 3170z -40 to +85 10 ld msop m10.118 isl3171eibz 3171 eibz -40 to +85 8 ld soic m8.15 isl3171eiuz 3171z -40 to +85 8 ld msop m8.118 isl3172eibz 3172 eibz -40 to +85 8 ld soic m8.15 isl3172eiuz 3172z -40 to +85 8 ld msop m8.118 isl3173eibz 3173eibz -40 to +85 14 ld soic m14.15 isl3173eiuz 3173z -40 to +85 10 ld msop m10.118 isl3174eibz 3174 eibz -40 to +85 8 ld soic m8.15 isl3174eiuz 3174z -40 to +85 8 ld msop m8.118 isl3175eibz 3175 eibz -40 to +85 8 ld soic m8.15 isl3175eiuz 3175z -40 to +85 8 ld msop m8.118 isl3176eibz 3176eibz -40 to +85 14 ld soic m14.15 isl3176eiuz 3176z -40 to +85 10 ld msop m10.118 isl3177eibz 3177 eibz -40 to +85 8 ld soic m8.15 isl3177eiuz 3177z -40 to +85 8 ld msop m8.118 isl3178eibz 3178 eibz -40 to +85 8 ld soic m8.15 isl3178eiuz 3178z -40 to +85 8 ld msop m8.118 notes: 1. add ?-t? suffix for tape and reel. please refer to tb347 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ special pb-free material sets, molding compounds/die attach materials , and 100% matte tin plate plus anneal (e3 termination finish, which is rohs complian t and compatible with both snpb and pb-free soldering operation s). intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std -020. 3. for moisture sensitivity level (msl), please see device information page for isl3170e , isl3171e , isl3172e , isl3173e , isl3174e , isl3175e , isl3176e , isl3177e, isl3178e . for more information on msl please see tech brief tb363 . isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
3 fn6307.5 june 8, 2012 truth tables transmitting inputs outputs re de di z y x1101 x1010 0 0 x high-z high-z 1 0 x high-z * high-z * note: *shutdown mode (see note 10), except for isl3171e, isl3174e, isl3177e truth tables (continued) receiving inputs output re de half duplex de full duplex a-b ro 00 x -0.05v 1 00 x -0.2v 0 0 0 x inputs open/shorted 1 1 0 0 x high-z * 1 1 1 x high-z note: *shutdown mode (see note 10), except for isl3171e, isl3174e, isl3177e pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a a nd b are unconnected (floating) or shorted. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. if the rx enable function isn?t required, connect re directly to gnd or through a 1k to 3k resistor to gnd. de driver output enable. the driver outputs, y and z, are enabled by bringing de high, and are high impedance when de is low. if the tx enable function isn?t requ ired, connect de to v cc through a 1k to 3k resistor. di driver input. a low on di forces output y low and output z hi gh. similarly, a high on di forces output y high and output z lo w. gnd ground connection. a/y 15kv iec61000 esd protected rs-485/422 level, noninverting receiver input and noninver ting driver output. pin is an input if de = 0; pin is an output if de = 1. b/z 15kv iec61000 esd protected rs-485/422 level, in verting receiver input and inverting driv er output. pin is an input if de = 0; pin is an output if de = 1. a 15kv iec61000 esd protected rs-485/422 level, noninverting receiver input. b 15kv iec61000 esd protected rs-485/422 level, inverting receiver input. y 15kv iec61000 esd protected rs-485/422 leve l, noninverting driver output. z 15kv iec61000 esd protected rs-485/422 level, inverting driver output. v cc system power supply input (3.0v to 3.6v). nc no connection. isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
4 fn6307.5 june 8, 2012 typical operating circuits isl3172e, isl3175e, isl3178e isl3171e, isl3174e, isl3177e isl3170e, isl3173e, isl3176e 0.1f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v 0.1f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v r t r t 0.1f + d r 8 7 6 5 1 2 3 4 v cc gnd ro di a b y z +3.3v 0.1f + d r 8 7 6 5 1 2 3 4 v cc gnd ro di a b y z +3.3v r t r t 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +3.3v 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +3.3v r t r t (pin numbers for soic) isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
5 fn6307.5 june 8, 2012 absolute maximum rati ngs thermal information v cc to gnd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v de, re (note 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v input/output voltages a, b, y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8v to +13v ro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c thermal resistance (typical, note 4) ja (c/w) 8 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . . 105 8 ld msop package . . . . . . . . . . . . . . . . . . . . . . . . 140 10 ld msop package . . . . . . . . . . . . . . . . . . . . . . . 190 14 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 128 maximum junction temperature (plastic package) . . . . . . +150c maximum storage temperature range . . . . . . . . . .-65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. note: 4. ja is measured with the component mounted on a high effective t hermal conductivity test board in free air. see tech brief tb379 for details. electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 5) parameter symbol test conditions temp (c) min (note 19) typ max (note 19) units dc characteristics driver differential v out v od r l = 100 (rs-422) (figure 1a, note 16) full 2 2.3 - v r l = 54 (rs-485) (figure 1a) full 1.5 2 v cc v no load - - v cc r l = 60 , -7v v cm 12v (figure 1b) full 1.5 2.2 - v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a) full - 2 3 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.01 0.2 v logic input high voltage v ih di, de, re full 2 - - v logic input low voltage v il di, de, re full - - 0.8 v logic input hysteresis v hys de, re (note 15) 25 - 100 - mv logic input current i in1 di = de = re = 0v or v cc (note 18) full -2 - 2 a input current (a, b, a/y, b/z) i in2 de = 0v, v cc = 0v or 3.6v v in = 12v full - 80 125 a v in = -7v full -100 -50 - a output leakage current (y, z) (full duplex versions only, note 13) i in3 re = 0v, de = 0v, v cc = 0v or 3.6v v in = 12v full - 10 40 a v in = -7v full -40 -10 - a output leakage current (y, z) in shutdown mode (full duplex, note 13) i in4 re = v cc , de = 0v, v cc = 0v or 3.6v v in = 12v full - 10 40 a v in = -7v full -40 -10 - a driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 7) full - - 250 ma receiver differential threshold voltage v th -7v v cm 12v full -200 -125 -50 mv receiver input hysteresis v th v cm = 0v 25 - 15 - mv isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
6 fn6307.5 june 8, 2012 receiver output high voltage v oh i o = -4ma, v id = -50mv full v cc - 0.6 - - v receiver output low voltage v ol i o = -4ma, v id = -200mv full - 0.17 0.4 v three-state (high impedance) receiver output current (note 13) i ozr 0.4v v o 2.4v full -1 0.015 1 a receiver input resistance r in -7v v cm 12v full 96 150 - k receiver short-circuit current i osr 0v v o v cc full 730 60 ma thermal shutdown threshold t sd full - 150 - c supply current no-load supply current (note 6) i cc di = 0v or v cc de = v cc , re = 0v or v cc full - 510 800 a de = 0v, re = 0v full - 480 700 a shutdown supply current (note 13) i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.01 12 a esd performance rs-485 pins (a, y, b, z, a/y, b/z) iec61000-4-2, air-gap discharge method 25 - 15 - kv iec61000-4-2, contact discharge method 25 - 8-kv human body model, from bus pins to gnd 25 - 15 - kv all pins hbm, per mil-std-883 method 3015 25 - 7-kv machine model 25 - 200 - v driver switching characteristics (isl3170e, isl3171e, isl3172e, 250kbps) maximum data rate f max v od = 1.5v, c d = 820pf (figure 4, note 17) full 250 800 - kbps driver differential output delay t dd r diff = 54 , c d = 50pf (figure 2) full 250 1100 1500 ns driver differential output skew t skew r diff = 54 , c d = 50pf (figure 2) full - 6 100 ns driver differential rise or fall time t r , t f r diff = 54 , c d = 50pf (figure 2) full 350 960 1600 ns driver enable to output high t zh r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 8, 13) full - 26 600 ns driver enable to output low t zl r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 8, 13) full - 200 600 ns driver disable from output high t hz r l = 500 , c l = 50pf, sw = gnd (figure 3), (note 13) full - 28 55 ns driver disable from output low t lz r l = 500 , c l = 50pf, sw = v cc (figure 3), (note 13) full - 30 55 ns time to shutdown t shdn (notes 10, 13) full 50 200 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 10, 11, 13) full - 180 700 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 10, 11, 13) full - 100 700 ns driver switching characteristics (isl3173e, isl3174e, isl3175e, 500kbps) maximum data rate f max v od = 1.5v, c d = 820pf (figure 4, note 17) full 500 1600 - kbps driver differential output delay t dd r diff = 54 , c d = 50pf (figure 2) full 180 350 800 ns driver differential output skew t skew r diff = 54 , c d = 50pf (figure 2) full - 1 30 ns driver differential rise or fall time t r , t f r diff = 54 , c d = 50pf (figure 2) full 200 380 800 ns electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 5) parameter symbol test conditions temp (c) min (note 19) typ max (note 19) units isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
7 fn6307.5 june 8, 2012 driver enable to output high t zh r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 8, 13) full - 26 350 ns driver enable to output low t zl r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 8, 13) full - 100 350 ns driver disable from output high t hz r l = 500 , c l = 50pf, sw = gnd (figure 3), (note 13) full - 28 55 ns driver disable from output low t lz r l = 500 , c l = 50pf, sw = v cc (figure 3), (note 13) full - 30 55 ns time to shutdown t shdn (notes 10, 13) full 50 200 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 10, 11, 13) full - 180 700 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 10, 11, 13) full - 100 700 ns driver switching characteristics (isl3176e, isl3177e, isl3178e, 20mbps) maximum data rate f max v od = 1.5v, c d = 350pf (figure 4, note 17) full 20 28 - mbps driver differential output delay t dd r diff = 54 , c d = 50pf (figure 2) full - 27 40 ns driver differential output skew t skew r diff = 54 , c d = 50pf (figure 2) full - 1 3 ns driver output skew, part-to-part t dskew r diff = 54 , c d = 50pf (figure 2, note 14) full - - 11 ns driver differential rise or fall time t r , t f r diff = 54 , c d = 50pf (figure 2) full - 9 15 ns driver enable to output high t zh r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 8, 13) full - 17 50 ns driver enable to output low t zl r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 8, 13) full - 16 40 ns driver disable from output high t hz r l = 500 , c l = 50pf, sw = gnd (figure 3), (note 13) full - 25 40 ns driver disable from output low t lz r l = 500 , c l = 50pf, sw = v cc (figure 3), (note 13) full - 28 50 ns time to shutdown t shdn (notes 10, 13) full 50 200 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 10, 11, 13) full - 180 700 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 10, 11, 13) full - 90 700 ns receiver switching characteristics (all versions) maximum data rate f max v id = 1.5v (note 17) isl3170e-75e full 12 20 - mbps isl3176e-78e full 20 35 - mbps receiver input to output delay t plh , t phl (figure 5) isl3170e-75e full 25 70 120 ns isl3176e-78e full 25 33 60 ns receiver skew | t plh - t phl |t skd (figure 5) full - 1.5 4 ns receiver skew, part-to-part t rskew (figure 5, note 14) full - - 15 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 9, 13) isl3170e-75e full 5 15 20 ns isl3176e-78e full 5 11 17 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 9, 13) isl3170e-75e full 5 15 20 ns isl3176e-78e full 5 11 17 ns electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 5) parameter symbol test conditions temp (c) min (note 19) typ max (note 19) units isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
8 fn6307.5 june 8, 2012 receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 13) isl3170e-75e full 5 12 20 ns isl3176e-78e full 4 7 15 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 13) isl3170e-75e full 5 13 20 ns isl3176e-78e full 4 7 15 ns time to shutdown t shdn (notes 10, 13) full 50 180 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 10, 12, 13) full - 240 500 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 10, 12, 13) full - 240 500 ns notes: 5. all currents into device pins are positive; all currents out of device pins are negative. all voltages are referenced to devi ce ground unless otherwise specified. 6. supply current specification is va lid for loaded drivers when de = 0v. 7. applies to peak current. see ?typical perform ance curves? starting on page 12 for more information. 8. when testing devices with the shutdown feature, keep re = 0 to prevent the device from entering shdn. 9. when testing devices with the shutdown feature, the re signal high time must be short enough (typic ally <100ns) to prevent the device from entering shdn. 10. versions with a shutdown feature are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. if the inputs are in this state for at least 600ns, the parts are guaranteed to hav e entered shutdown. see ?low power shutdown mode? on page 12. 11. keep re = vcc, and set the de signal low time >600ns to ensure that the device enters shdn. 12. set the re signal high time >600ns to ensure that the device enters shdn. 13. does not apply to the isl3171e, isl3174e and isl3177e. 14. t skew is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test co nditions (v cc , temperature, etc.). only applies to the isl3176e through isl3178e. 15. isl3170e through isl3175e only. 16. v cc 3.15v 17. limits established by characterization and are not production tested. 18. if the tx or rx enable functi on isn?t needed, connect the enable pin to the appr opriate supply (see ?pin descriptions? on pa ge 3) through a 1k to 3k resistor. 19. parameters with min and/or max limits are 100% tested at +25 c, unless otherwise specified. temperature limits established b y characterization and are not production tested. 20. if the de or re input voltage exceeds the v cc voltage by more than 500mv, then current will flow into the logic pin. the current is limited by a 340 ? resistor (so 13ma with v in = 5v and v cc = 0v) so no damage will occur if v cc v in 7v for short periods of time. test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 5) parameter symbol test conditions temp (c) min (note 19) typ max (note 19) units d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
9 fn6307.5 june 8, 2012 figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times (except isl3171e, isl3174e, isl3177e) figure 4a. test circuit figure 4b. measurement points figure 4. driver data rate test circuits and waveforms (continued) d de di v cc signal generator c d r diff z y out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y to z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw t hz y/z x 1/0 gnd t lz y/z x 0/1 v cc t zh y/z 0 (note 8) 1/0 gnd t zl y/z 0 (note 8) 0/1 v cc t zh(shdn) y/z 1 (note 11) 1/0 gnd t zl(shdn) y/z 1 (note 11) 0/1 v cc signal generator 500 50pf out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.25v t hz out (y, z) v cc v ol v ol + 0.25v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 10 50% 50% note 10 note 10 d de di v cc signal generator z y c d v od + - 54 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
10 fn6307.5 june 8, 2012 application information rs-485 and rs-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 spec requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for runs as long as 4000?, so the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver features these devices utilize a differential input receiver for maximum noise immunity and common mode rejection. input sensitivity is better than 200mv, as required by the rs-422 and rs-485 specifications. receiver input resistance of 96k surpasses the rs-422 spec of 4k and is eight times the rs-485 ?unit load (ul)? requirement of 12k minimum. thus, these products are known as ?one-eighth ul? tran sceivers and there can be up to 256 of these devices on a network while still complying with the rs-485 l oading specification. receiver inputs function with common mode voltages as great as +9v/-7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks where induced voltages and ground potential differenc es are realistic concerns. all the receivers include a ?full fail-safe? function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or sh orted. fail-safe with shorted inputs is achieved by setting the rx upper switching point to -50mv, thereby ensuring that the rx sees 0v differential as a high input level. figure 5a. test circuit figure 5b. measurement points figure 5. receiver propagation delay figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times (except isl3171e, isl3174e, isl3177e) test circuits and waveforms (continued) signal generator r ro re a b gnd 15pf ro +1.5v -1.5v t plh 0v 0v v cc 0v 1.5v 1.5v t phl a 1k v cc gnd sw parameter de a sw t hz x +1.5v gnd t lz x -1.5v v cc t zh (note 9) 0 +1.5v gnd t zl (note 9) 0 -1.5v v cc t zh(shdn) (note 12) 0 +1.5v gnd t zl(shdn) (note 12) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.25v t hz ro v cc v ol 1.5v v ol + 0.25v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 10 note 10 note 10 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
11 fn6307.5 june 8, 2012 receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs (except on the isl3171e, isl3174e and isl3177e) are tri-statable via the active low re input. driver features the rs-485/422 driver is a diff erential output device that delivers at least 1.5v across a 54 load (rs-485) and at least 2v across a 100 load (rs-422). the drivers feature low propagation delay skew to maximize bit width and to minimize emi. all drivers are tri-statable via th e active high de input, except on the isl3171e, isl3174e and isl3177e. the 250kbps and 500kbps driver outputs are slew rate limited to minimize emi and to reduce reflections in unterminated or improperly terminated networks. outputs of the isl3176e through isl3178e drivers are not limited, so faster output transition times allow data rates of at least 20mbps. hot plug function when a piece of equipment powers up, there is a period of time where the processor or as ic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. to avoid this scenario, the isl317xe versions with output enable pins incorporate a ?hot plug? function. during power up, circuitry monitoring v cc ensures that the tx and rx outputs remain disabled for a period of time, regardless of the state of de and re . this gives the processor/asic a chance to st abilize and drive the rs-485 control lines to the proper states. esd protection all pins on these devices in clude class 3 (>7kv) human body model (hbm) esd protec tion structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive esd events in excess of 15kv hbm and 15kv iec61000. the rs-485 pins are particularly vulnerable to esd damage because they typi cally connect to an exposed port on the exterior of the finished product. simply touching the port pins, or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, and without degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are exposed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to -pin combination. the lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-485 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. the isl317xe rs-485 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. the isl317xe survive 8kv contact discharges on the rs-485 pins. data rate, cables, and terminations rs-485/422 are intended for network lengths up to 4000?, but the maximum system data rate decreases as the transmission length increases. devices operating at 20mbps are limited to lengths less than 100?, while the 250kbps versions can operate at full da ta rates with lengths of several thousand feet. twisted pair is the cable of choice for rs-485/422 networks. twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ics. proper termination is imperative, when using the 20mbps devices to minimize reflections. short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. in point-to-point, or point-to-mu ltipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 ) at the end farthest from the driver. in multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
12 fn6307.5 june 8, 2012 built-in driver ov erload protection as stated previously, the rs-485 spec requires that drivers survive worst case bus contentions undamaged. these devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. the driver output stages inco rporate short circuit current limiting circuitry which ensures that the output current never exceeds the rs-485 spec, even at the common mode voltage range extremes. additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. in the event of a major short circuit condition, devices also include a thermal shutdown featur e that disables the drivers whenever the die temperature becomes excessive. this eliminates the power dissipation, allowing the die to cool. the drivers automatically re-enable after the die temperature drops about 15. if the content ion persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. receivers stay operational during thermal shutdown. low power shutdown mode these cmos transceivers all use a fraction of the power required by their bipol ar counterparts, but some also include a shutdown feature that reduces the already low quiescent i cc to a 10na trickle. these devices enter shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and the receiver for less than 50ns guarantees that t he transceiver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 8 through 12, at the end of the ?electrical specification table? on page 8, for more information. typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified figure 7. driver output current vs differential output voltage figure 8. driver differential output voltage vs temperature figure 9. driver output current vs short circuit voltage figure 10. supply current vs temperature differential output voltage (v) driver output current (ma) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 20 40 60 80 100 120 -40 0 50 85 temperature (c) differential output voltage (v) -25 25 75 r diff = 100 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 2.25 2.30 2.35 r diff = 54 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
13 fn6307.5 june 8, 2012 figure 11. driver differential propagation delay vs temperature (isl3170e, isl3171e, isl3172e) figure 12. driver differential skew vs temperature (isl3170e, isl3171e, isl3172e) figure 13. driver differential propagation delay vs temperature (isl3173e, isl3174e, isl3175e) figure 14. driver differential skew vs temperature (isl3173e, isl3174e, isl3175e) typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified (continued) -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) t plh t phl 1080 1100 1120 1140 1160 1180 1200 1220 -40 0 50 85 temperature (c) skew (ns) -25 25 75 5.5 6.0 6.5 7.0 7.5 8.0 | cross point of y and z ? cross point of y and z | -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) t plh t phl 340 345 350 355 360 365 370 -40 0 50 85 temperature (c) skew (ns) -25 25 75 0.2 0.4 0.6 0.8 1.0 1.2 1.4 | cross point of y and z ? cross point of y and z | isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
14 fn6307.5 june 8, 2012 figure 15. driver differential propagation delay vs temperature (isl3176e, isl3177e, isl3178e) figure 16. driver differential skew vs temperature (isl3176e, isl3177e, isl3178e) figure 17. driver and receiver waveforms, low to high (isl3170e, isl3171e, isl3172e) figure 18. driver and receiver waveforms, high to low (isl3170e, isl3171e, isl3172e) typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified (continued) -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 22 23 24 25 26 27 28 29 30 31 32 t phl t plh -40 0 50 85 temperature (c) skew (ns) -25 25 75 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 | cross point of y and z ? cross point of y and z | time (400ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y time (400ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
15 fn6307.5 june 8, 2012 figure 19. driver and receiver waveforms, low to high (isl3173e, isl3174e, isl3175e) figure 20. driver and receiver waveforms, high to low (isl3173e, isl3174e, isl3175e) figure 21. driver and receiver waveforms, low to high (isl3176e, isl3177e, isl3178e) figure 22. driver and receiver waveforms, high to low (isl3176e, isl3177e, isl3178e) figure 23. receiver output current vs receiver output voltage die characteristics substrate potential (powered up): gnd transistor count: 535 process: si gate bicmos typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified (continued) time (200ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y time (200ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1 1.5 2 2.5 3 b/z a/y time (10ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y time (10ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y receiver output voltage (v) receiver output current (ma) 01.02.03.03.5 1.5 2.5 0.5 0 5 10 15 20 25 30 35 v oh , +25c v oh , +85c v ol , +25c v ol , +85c isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e
16 fn6307.5 june 8, 2012 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e package outline drawing m8.118 8 lead mini small outline plastic package rev 4, 7/11 detail "x" side view 2 typical recommended land pattern top view pin# 1 id 0.25 - 0.36 detail "x" 0.10 0.05 (4.40) (3.00) (5.80) h c 1.10 max 0.09 - 0.20 33 gauge plane 0.25 0.95 ref 0.55 0.15 b 0.08 c a-b d 3.00.05 12 8 0.85010 seating plane a 0.65 bsc 3.00.05 4.90.15 (0.40) (1.40) (0.65) d 5 5 side view 1 dimensioning and tolerancing conform to jedec mo-187-aa plastic interlead protrusions of 0.15mm max per side are not dimensions in ( ) are for reference only. dimensions are measured at datum plane "h". plastic or metal protrusions of 0.15mm max per side are not dimensions are in millimeters. 3. 4. 5. 6. notes: 1. 2. and amsey14.5m-1994. included. included. 0.10 c m
17 fn6307.5 june 8, 2012 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e package outline drawing m8.15 8 lead narrow body small outline plastic package rev 4, 1/12 detail "a" top view index area 123 -c- seating plane x 45 notes: 1. dimensioning and tolerancing per ansi y14.5m-1994. 2. package length does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. package width does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 5. terminal numbers are shown for reference only. 6. the lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. controlling dimension: millimeter. co nverted inch dimensions are not necessarily exact. 8. this outline conforms to jedec publication ms-012-aa issue c. side view ?a side view ?b? 1.27 (0.050) 6.20 (0.244) 5.80 (0.228) 4.00 (0.157) 3.80 (0.150) 0.50 (0.20) 0.25 (0.01) 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 0.25(0.010) 0.10(0.004) 0.51(0.020) 0.33(0.013) 8 0 0.25 (0.010) 0.19 (0.008) 1.27 (0.050) 0.40 (0.016) 1.27 (0.050) 5.20(0.205) 1 2 3 4 5 6 7 8 typical recommended land pattern 2.20 (0.087) 0.60 (0.023)
18 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6307.5 june 8, 2012 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only l 0.25 (0.010) l1 r1 r 4x q 4x q gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m10.118 (jedec mo-187ba) 10 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.020 bsc 0.50 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n10 107 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 0 12/02
19 fn6307.5 june 8, 2012 isl3170e, isl3171e, isl3172e, is l3173e, isl3174e, isl3175e, isl3176e, isl3177e, isl3178e package outline drawing m14.15 14 lead narrow body small outline plastic package rev 1, 10/09 a d 4 0.25 a-b mc c 0.10 c 5 b d 3 0.10 a-b c 4 0.20 c 2x 2x 0.10 d c 2x h 0.10 c 6 3 6 id mark pin no.1 (0.35) x 45 seating plane gauge plane 0.25 (5.40) (1.50) 1.27 0.31-0.51 4 4 detail"a" 0.220.03 0.10-0.25 1.25 min 1.75 max (1.27) (0.6) 6.0 8.65 3.9 7 14 8 dimensioning and tolerancing conform to amsey14.5m-1994. dimension does not include interlead flash or protrusions. dimensions in ( ) for reference only. interlead flash or protrusions shall not exceed 0.25mm per side. datums a and b to be determined at datum h. 4. 5. 3. 2. dimensions are in millimeters. notes: 1. the pin #1 indentifier may be either a mold or mark feature. 6. does not include dambar protrusion. allowable dambar protrusion 7. reference to jedec ms-012-ab. shall be 0.10mm total in excess of lead width at maximum condition. detail "a" side view typical recommended land pattern top view

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